Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

US Patent 7857189 · Granted Dec 28, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Copper alloy, plastically worked copper alloy material, component for electronic2025
Pure copper material, insulating substrate, and electronic device2025
Slit copper material, part for electric/electronic device, bus bar, heat dissipa2025
Pure copper material, insulating substrate, and electronic device2025
Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with platin2025
Copper alloy, copper alloy plastic working material, component for electronic/el2025
Copper alloy plate, copper alloy plate with plating film, and methods for produc2024
Copper alloy sheet, copper alloy sheet with plating film, and method for produci2024
Terminal material for connector2024
Copper alloy plate, copper alloy plate with plating film, and manufacturing meth2023
Copper alloy plate, plating film-attached copper alloy plate, and methods respec2023
Copper alloy for electronic/electric device, copper alloy sheet/strip material f2023