Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power device package and method of fabricating the same

Power device package and method of fabricating the same

US Patent 7846779 · Granted Dec 7, 2010

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Complex semiconductor packages and methods of fabricating the same2014
Power device package and method of fabricating the same2012
Power module package having improved heat dissipating capability2007
Power module package having improved heat dissipating capability2006