Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to optimize substrate thickness for image sensor device

Method to optimize substrate thickness for image sensor device

US Patent 7838325 · Granted Nov 23, 2010

Estimated economic value: $4,350,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Isolation structure configured to reduce cross talk in image sensor2025
Indoor cabinets having reduced acoustic footprints2025
Image sensor having an improved structure for small pixel designs2025
Controlling electric fans of cabinet assemblies2025
Isolation structure for bond pad structure2025
High-speed readout image sensor2025
Isolation structure for bond pad structure2025
Hybrid bonding technology for stacking integrated circuits2025
Isolation structure to increase image sensor performance2025
Hybrid bond pad structure2025
Controlled airflow design for indoor cabinet2025
Memory device for computing in-memory2025