Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Return loss techniques in wirebond packages for high-speed data communications

Return loss techniques in wirebond packages for high-speed data communications

US Patent 7825527 · Granted Nov 2, 2010

Estimated economic value: $14,049,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System for managing device power consumption and method, device and storage medi2025
Anti-ICOS and anti-PD-1 antibody combination therapy2023
Power distribution network2017
Integrated circuit package routing with reduced crosstalk2016
IC package with non-uniform dielectric layer thickness2016
Tunable power distribution network and method of use thereof2016
Integrated circuit package with reduced pad capacitance2016
Self-tuning high speed transceiver for IC wireline channel2015
Adjustable drive strength input-output buffer circuitry2015
Thermometer-code-to-binary encoders2015
Techniques for attenuating resonance induced impedance in integrated circuits2015
Methods and apparatus for transceiver power noise reduction2014