Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and apparatus for polishing a semiconductor wafer

Methods and apparatus for polishing a semiconductor wafer

US Patent 7824244 · Granted Nov 2, 2010

Estimated economic value: $51,358,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermally strengthened consumer electronic glass and related systems and methods2025
Cationic copolymers with pendant N-allylimidazolium groups2024
Copolymers with cationic, nitrogen-containing groups and anion exchange membrane2024
Thermally strengthened consumer electronic glass and related systems and methods2024
Selective masking and plugging of honeycomb bodies2023
Translating fluid bearings during an optical fiber draw process2023
Copolymers containing pendant ionomeric carbosilane groups2023
Thin thermally and chemically strengthened glass-based articles2023
Extrusion dies and methods and apparatuses for forming the same2021
Thermally strengthened consumer electronic glass and related systems and methods2021
Laser welding transparent glass panes using a low emissivity coating2021
Thermally strengthened architectural glass and related systems and methods2020