Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

US Patent 7821131 · Granted Oct 26, 2010

Estimated economic value: $15,337,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Retaining panel for radiant thermal transfer and method2017
Film interposer for integrated circuit devices2016
Methods and systems for IC card application loading2009
Using active and passive optical components for an optical network2008
Spatially-spectrally swept optical memories and addressing methods2007
Method for writing a planar waveguide having gratings of different center wavele2007
Athermal package for fiber bragg gratings with compensation for non-linear therm2007
Apparatus and methods for stabilization and control of fiber devices and fiber d2007
Optical phased array transmitter/receiver2006
Code-based optical networks, methods, and apparatus2006
Method for writing a planar waveguide having gratings of different center wavele2006
Spatially-spectrally swept optical memories and addressing methods2005