Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having active element formation region provided under a bump pad

Semiconductor device having active element formation region provided under a bump pad

US Patent 7777334 · Granted Aug 17, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vibrator element including base part, vibrating arm and weight provided to vibra2024
Cation-exchange membrane, electrolyzer, and method for producing cation-exchange2024
Vibrator element, vibrator device, and method of manufacturing vibrator element2024
Semiconductor device including a buffer layer structure for reducing stress2020
Semiconductor device including a buffer layer structure for reducing stress2018
Semiconductor device including semiconductor chip, wiring, conductive material, 2017
Semiconductor device including a buffer layer structure for reducing stress2016
Semiconductor device including a buffer layer structure for reducing stress2016
Vibration device2015
Semiconductor device including a buffer layer structure for reducing stress2015
Semiconductor device including a buffer layer structure for reducing stress2015
Semiconductor device having a conductive layer reliably formed under an electrod2014