Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor laser diode having wafer-bonded structure and method of fabricating the same

Semiconductor laser diode having wafer-bonded structure and method of fabricating the same

US Patent 7773649 · Granted Aug 10, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photoresist stripper composition for manufacturing display2025
Optical beam steering devices and sensor systems including the same2023
Pile lifting device capable of preventing overturning2023
Optical integrated circuit device array having bi-directional characteristics an2022
Semiconductor laser device and method of manufacturing the same2022
Optical beam steering devices and sensor systems including the same2021
Hybrid silicon lasers on bulk silicon substrates2021
Hydraulic jack expansion-type rotary penetration device for circular pipe2021
Optical phased array (OPA)2020
Optical transmitters including photonic integrated circuit2019
Optical device and method of manufacturing the same2018
Optical interface module for coherent reception, optical memory module, and opti2016