Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fully tested wafers having bond pads undamaged by probing and applications thereof

Fully tested wafers having bond pads undamaged by probing and applications thereof

US Patent 7723980 · Granted May 25, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Platform to manipulate golf data to enable creation of broadcast production grap2025
General purpose command system and interface for a live broadcast2025
Stacked and folded above motherboard interposer2021
Wafer testing system and associated methods of use and manufacture2020
Interposer with high bandwidth connections between a central processor and memor2019
Designed asperity contactors, including nanospikes, for semiconductor test using2017
Wafer testing system and associated methods of use and manufacture2017
Wafer prober integrated with full-wafer contacter2017
Designed asperity contactors, including nanospikes, for semiconductor test using2016
Full-water test and burn-in mechanism2016
Above motherboard interposer with quarter wavelength electrical paths2016
Translators coupleable to opposing surfaces of microelectronic substrates for te2015