Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer

Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer

US Patent 7723826 · Granted May 25, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
Semiconductor device2025
Semiconductor device2020
Semiconductor element test apparatus and semiconductor element test method2019
Semiconductor device2018
Circuit and method for inspecting semiconductor device2018
Method of manufacturing semiconductor device including wiring layout and semicon2013
Method of manufacturing semiconductor device including wiring layout and semicon2013
Method of manufacturing semiconductor device2013
Chemical mechanical polishing method and chemical mechanical polishing device2012
Chemical mechanical polishing method and chemical mechanical polishing device2012
Wafer, reticle, and exposure method using the wafer and reticle2010