Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods

Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods

US Patent 7708050 · Granted May 4, 2010

Estimated economic value: $84,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing ceramic sintered body and ceramic sintered body2018
Ceramic core, manufacturing method for the same, manufacturing method for castin2017
Oxide semiconductor target, oxide semiconductor film and method for producing sa2017
Ceramic core and method for producing same2017
Oxide semiconductor target and oxide semiconductor material, as well as semicond2016
Composite material, having high thermal conductivity and low thermal expansion c2011
High-thermal-conductivity graphite-particles-dispersed-composite and its product2010
Composite material having high thermal conductivity and low thermal expansion co2007
Setter for burning2004
Alumina ceramic composition2002
Piezoelectric sintered ceramics and piezoelectric ceramic elements constituted t2001
Multilayered electronic part with minimum silver diffusion2000