Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heatsink, method of manufacturing same, and microelectronic package containing same

Heatsink, method of manufacturing same, and microelectronic package containing same

US Patent 7692922 · Granted Apr 6, 2010

Estimated economic value: $11,081,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High performance transient uniform cooling solution for thermal compression bond2018
Direct air impingement cooling of package structures2017
Hybrid heat exchanger2017
Direct liquid-contact micro-channel heat transfer devices, methods of temperatur2016
High performance transient uniform cooling solution for thermal compression bond2016
Direct liquid-contact micro-channel heat transfer devices, methods of temperatur2016
Low profile heat spreader and methods2016
Transient thermal management systems for semiconductor devices2015
Hybrid heat exchanger2013
Method and apparatus for two-phase start-up operation2012
Electrically conductive fluid interconnects for integrated circuit devices2011
Airflow control system2011