Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit with staggered differential wire bond pairs

Integrated circuit with staggered differential wire bond pairs

US Patent 7675168 · Granted Mar 9, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-layer integrated transmission line circuits having a metal routing layer t2015
Method of generating a leadframe IC package model, a leadframe modeler and an IC2013
Method and article of manufacture for wire bonding with staggered differential w2011
Method and article of manufacture for wire bonding with staggered differential w2011
Method and article of manufacture for wire bonding with staggered differential w2011
Inductive coupling for communications equipment interface circuitry2011
Integrated circuit package for high-speed signals2010
Integrated circuit package for high-speed signals2010
Wire bonding method and related device for high-frequency applications2010
Apparatus and method for extending laser life by discontinuous operation1993
Volume control apparatus1992
Scanning system presence sensing apparatus and method1991