Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate marking using encapsulated materials

Substrate marking using encapsulated materials

US Patent 7670659 · Granted Mar 2, 2010

Estimated economic value: $16,131,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compositions and methods for treating bleeding and bleeding disorders2025
Electrical measurement of a green object during sintering2024
Transmitting and detecting light with optical fiber during sintering2023
Films or surfaces including positional tracking marks2023
Support structures and interfaces2022
Three-dimensional printing2022
Detecting a drive bubble formation and collapse2021
Formulations and products to replace single-use plastics and polystyrene with bi2021
Apparatus with microelectromechanical die and application specific integrated ci2020
Films or surfaces including positional tracking marks2020
Modifying firing parameters for printheads2020
Printhead circuit2019