Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structures with interlayer dielectric

Interconnect structures with interlayer dielectric

US Patent 7659630 · Granted Feb 9, 2010

Estimated economic value: $4,497,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices with package-level configurability2023
Test device and method for top-of-the-line corrosion of high-temperature high-pr2022
Semiconductor devices with package-level configurability2021
Semiconductor devices with package-level configurability2020
Semiconductor devices with package-level configurability2019
Semiconductor devices with package-level configurability2018
Pixel array with shared pixels in a single column and associated devices, system2018
Pixel array with shared pixels in a single column and associated devices, system2017
Vertical 4-way shared pixel in a single column with internal reset and no row se2015
Integrated circuit having pitch reduced patterns relative to photoithography fea2013
Vertical 4-way shared pixel in a single column with internal reset and no row se2013
Pitch reduced patterns relative to photolithography features2012