Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density in-package microelectronic amplifier

High density in-package microelectronic amplifier

US Patent 7626827 · Granted Dec 1, 2009

Estimated economic value: $25,817,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mounting configurations for optoelectronic components in LiDAR systems2023
Method for operating a combined cycle power plant and combined cycle power plant2018
Combined cycle power plant2017
Integrated multi-channel analog front end and digitizer for high speed imaging a2016
Image synchronization of scanning wafer inspection system2015
Image synchronization of scanning wafer inspection system2015
Integrated multi-channel analog front end and digitizer for high speed imaging a2014
Detection system for nanometer scale topographic measurements of reflective surf2013
Detection system for nanometer scale topographic measurements of reflective surf2008
Methods and systems for preparing a sample for thin film analysis2007
Film measurement with interleaved laser cleaning2006
Detection system for nanometer scale topographic measurements of reflective surf2006