Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized

3 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized

US Patent 7626817 · Granted Dec 1, 2009

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for sharing co-generated energy when processing essential e2024
Method and apparatus for sharing co-generated energy when processing essential e2022
Nozzles for essential element extraction method and apparatus2021
Recycling cannabinoid extractor2021
Essential element management2020
Essential element management2018
Recycling cannabinoid extractor2016
Essential element management2015
Extensible robust modular electronic device without direct electrical connection2010
Electronic package whereby an electronic assembly is packaged within an enclosur2010
Robust modular electronic device without direct electrical connections for inter2008
Shaft assembly having improved seal2001