Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for improving mechanical properties of low dielectric constant materials

Method for improving mechanical properties of low dielectric constant materials

US Patent 7622400 · Granted Nov 24, 2009

Estimated economic value: $3,335,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plasma-enhanced deposition of film stacks2025
Low stress films for advanced semiconductor applications2025
Concentration control using a bubbler2025
Progressive heating of components of substrate processing systems using TCR elem2024
Pad raising mechanism in wafer positioning pedestal for semiconductor processing2024
PECVD apparatus for in-situ deposition of film stacks2023
Pad raising mechanism in wafer positioning pedestal for semiconductor processing2022
Garment and hood hanger2022
Progressive heating of components of substrate processing systems using TCR elem2021
Wafer positioning pedestal for semiconductor processing2021
Moment cancelling pad raising mechanism in wafer positioning pedestal for semico2020
Controlling showerhead heating via resistive thermal measurements2020