Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manifold assembly having a centralized pressure sensing package

Manifold assembly having a centralized pressure sensing package

US Patent 7614307 · Granted Nov 10, 2009

Estimated economic value: $10,293,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal complexes, methods of making the same, and uses thereof2024
Multidentate phenanthridine-containing ligand frameworks and their planar monofu2022
System and method for autostereoscopic imaging using holographic optical element2019
Method of controlling fluid pressure-actuated switching component and control sy2016
Separator system and method for separating groups of product for separate proces2015
Box closing apparatus2013
Pressure sensing module having an integrated seal plate and method of assembling2013
Solenoid driven application mechanism2012
Fluid level detection system2012
Manifold assembly having a centralized pressure sensing package2011
Manifold assembly having a centralized pressure sensing package2011
Manifold assembly having a centralized pressure sensing package2011