Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnection device including one or more embedded vias and method of producing the same

Interconnection device including one or more embedded vias and method of producing the same

US Patent 7608470 · Granted Oct 27, 2009

Estimated economic value: $28,062,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Selective polymer growth on a semiconductor substrate2013
High rate selective polymer growth on a substrate2012
Method for processing a MEMS/CMOS cantilever based memory storage device2010
Method for processing a MEMS/CMOS cantilever based memory storage device2008
Electro mechanical device having a sealed cavity2007
Module integrating MEMS and passive components2007
Tapered electrode in an acoustic resonator2006
Tapered electrode in an acoustic resonator2005
Reduced substrate micro-electro-mechanical systems (MEMS) device and system for 2005