Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die attachment for high vacuum tubes

Semiconductor die attachment for high vacuum tubes

US Patent 7607560 · Granted Oct 27, 2009

Estimated economic value: $1,807,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compact proximity focused image sensor2024
Rotatable stage2023
Compact proximity focused image sensor2023
Thermally assisted negative electron affinity photocathode2020
Image intensifier with indexed compliant anode assembly2017
Backside-thinned image sensor using Al2 O3 surface passivation2015
Collimator bonding structure and method2014
Semiconductor die attachment for high vacuum tubes2009
Photocathode structure and operation2009
Backside imaging through a doped layer2009
Unitary vacuum tube incorporating high voltage isolation2008
Backside thinning of image array devices2006