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Home › Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

US Patent 7592860 · Granted Sep 22, 2009

Estimated economic value: $31,451,000 ⓘ

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