Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming semiconductor device

Method for forming semiconductor device

US Patent 7585790 · Granted Sep 8, 2009

Estimated economic value: $4,327,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Image sensor with dummy polysilicon based extension pad2025
Image sensor having an improved structure for small pixel designs2025
Vertical gate field effect transistor2025
Semiconductor device and method of manufacture2025
Lateral diffusion metal-oxide semiconductor device2025
Isolation structure to increase image sensor performance2025
Lateral diffusion metal-oxide semiconductor device2025
Semiconductor device including image sensor and method of forming the same2025
Electrical fuse (e-fuse) one-time programmable (OTP) device and manufacturing me2025
Semiconductor device and method of forming the same2025
Bond pad structure with high via density2025
Extra doped region for back-side deep trench isolation2025