Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same

Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same

US Patent 7560355 · Granted Jul 14, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing super junction for semiconductor device2016
Super junction for semiconductor device and method for manufacturing the same2016
Trench MOS device having a termination structure with multiple field-relaxation 2015
Low forward voltage drop transient voltage suppressor and method of fabricating2015
Low forward voltage drop transient voltage suppressor and method of fabricating2015
Double trench rectifier2015
Manufacturing method of multi-trench termination structure for semiconductor dev2014
MOS diode with termination structure and method for manufacturing the same2014
Multi-trench termination structure for semiconductor device2014
Double trench rectifier2014
Trench MOS barrier schottky (TMBS) having multiple floating gates2013
Double trench rectifier2012