Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having filler with thermal conductive particles

Semiconductor device having filler with thermal conductive particles

US Patent 7554192 · Granted Jun 30, 2009

Estimated economic value: $280,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power semiconductor device2025
Methods for manufacturing a semiconductor device2024
Semiconductor device including a groove within a resin insulating part positione2023
Semiconductor device2022
Semiconductor device and method of manufacturing semiconductor device, power con2022
Semiconductor module and power conversion device2021
Semiconductor module2021
Semiconductor device2020
Semiconductor device2020
Semiconductor device2020
Radiation plate structure, semiconductor device, and method for manufacturing ra2020
Power semiconductor device2019