Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Uniform current distribution for ECP loading of wafers

Uniform current distribution for ECP loading of wafers

US Patent 7544281 · Granted Jun 9, 2009

Estimated economic value: $10,397,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Contact features of semiconductor device and method of forming same2025
Method for forming dual silicide in manufacturing process of semiconductor struc2025
Automatic document feeder2025
Contact with a silicide region2025
Interconnect structure of semiconductor device2025
Methods of forming semiconductor device structures2025
Semiconductor structure and method of forming the same2025
Semiconductor device pre-cleaning2025
Ammonium fluoride pre-clean protection2025
Phase control in contact formation2025
Contact features of semiconductor device and method of forming same2025
Semiconductor devices and methods of manufacturing2025