Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating back-illuminated imaging sensors using a bump bonding technique

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

US Patent 7541256 · Granted Jun 2, 2009

Estimated economic value: $48,372,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor with upconversion layer2025
Extended dynamic range imaging sensor and operating mode of the same2020
System for powering dual magnetrons using a dual power supply2019
Extended dynamic range imaging sensor and operating mode of the same2019
Means and methods for facilitating trauma integration2018
Metal container conveyor systems including diverter mechanisms, and metal contai2018
Large area high-uniformity UV source with many small emitters2017
Multi-spectral electrodeless ultraviolet light source, lamp module, and lamp sys2017
Method for electronically pinning a back surface of a back-illuminated imager fa2016
Method for electronically pinning a back surface of a back-illuminated imager fa2016
System and method for powering dual magnetrons using a dual power supply2016
UV lamp and a cavity-less UV lamp system2015