Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Isolation scheme for reducing film stress in a MEMS device

Isolation scheme for reducing film stress in a MEMS device

US Patent 7514285 · Granted Apr 7, 2009

Estimated economic value: $6,822,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Repositionable divider and container reinforcing coupler2025
Differential pressure sensor full overpressure protection device2019
Integrated SOI pressure sensor having silicon stress isolation member2018
Integrated SOI pressure sensor having silicon stress isolation member2018
Pressure sensor die over pressure protection for high over pressure to operating2018
Silicon-on-sapphire device with minimal thermal strain preload and enhanced stab2018
Systems and methods for mounting the printed wiring assembly to the header assem2017
Integrated reference vacuum pressure sensor with atomic layer deposition coated 2015
Systems and methods for a pressure sensor having a two layer die structure2014
Deep sea pH sensor2014
Apparatus and processes for silicon on insulator MEMS pressure sensors2014
Apparatus and processes for silicon on insulator MEMS pressure sensors2014