Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines

Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines

US Patent 7496251 · Granted Feb 24, 2009

Estimated economic value: $4,380,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solid-state switch2025
Multi-layer topological interconnect with proximal doping layer2025
Phase-change memory device with conductive cladding2025
Piezoelectric memory2025
Vanity mirror with second mirror assembly magnetically attached thereto2025
Containers with multiple sensors2025
Phase-change memory cell with mixed-material switchable region2025
RRAM filament location for physically unclonable function2025
Integrated circuit security using programmable switches2024
Transfer length phase change material (PCM) based bridge cell2024
Vanity mirror with second mirror assembly magnetically attached thereto2024
Cell culturing structure including growth medium and non-growth medium2024