Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sub-assembly

Sub-assembly

US Patent 7477518 · Granted Jan 13, 2009

Estimated economic value: $197,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

U-shaped vertical shunt resistor for Power Semiconductor module2018
Semiconductor assembly having a housing2016
Semiconductor component with moisture barrier for sealing semiconductor body2016
Pressure contact arrangement and method for producing a pressure contact arrange2015
Connecting system for electrically connecting electronic devices and method for 2014
Power semiconductor module, method for producing a power semiconductor module an2013
Power semiconductor module and method for operating a power semiconductor module2013
Power semiconductor arrangement and method for producing a power semiconductor a2013
Method for producing a power semiconductor arrangement2013
Power semiconductor module including substrates spaced from each other2013
Semiconductor module having an insert and method for producing a semiconductor m2013
Power semiconductor module with interconnected package portions2012