{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for determining addendum and binder surfaces of springback compensated stamping dies", "item": "https://www.patentleaderboard.com/patent/7464011"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for determining addendum and binder surfaces of springback compensated stamping dies

Method for determining addendum and binder surfaces of springback compensated stamping dies

US Patent 7464011 · Granted Dec 9, 2008

Estimated economic value: $23,210,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for post-synthetic modification of metal-organic frameworks for enhancing2025
Compression structures for IC packages2025
Contaminant-sequestering coatings and methods of using the same2025
Parallel clock salinity sensor2025
Magnetorheological fluid brake and control method therefor2025
Methods of forming and stamping tailor friction stir welded blanks with enhanced2024
Electrospun nanofibers2024
Contaminate sequestering coatings and methods of using the same2024
Forming die with reverse bead geometry2023
Electronic cigarette2023
Method and apparatus for searching multimedia content device, and storage medium2023
Water harvesting device2023