Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonding structure with buffer layer and method of forming the same

Bonding structure with buffer layer and method of forming the same

US Patent 7446421 · Granted Nov 4, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conjugation linkers, cell binding molecule-drug conjugates containing the linker2025
Conjugation linkers, cell binding molecule-drug conjugates containing the linker2025
Specific conjugation linkers, specific immunoconjugates thereof, methods of maki2025
Conjugation linkers, cell binding molecule-drug conjugates containing the linker2025
Chip package and method for forming the same2025
Conjugation linkers, cell binding molecule-drug conjugates containing the linker2025
Printed circuit board mesh routing to reduce solder ball joint failure during re2025
Chip package and manufacturing method thereof2025
Chip package and method for forming a chip package having first and second stack2025
Method of performing power saving control on display device and related display 2025
Chip package and method for forming the same2025
Gelled electrolyte and preparation method thereof2024