Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Polymer for sealing porous materials during chip production

Polymer for sealing porous materials during chip production

US Patent 7442756 · Granted Oct 28, 2008

Estimated economic value: $283,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power system assembly for a power machine2025
Carrier for pet tag and electronic tracking device2025
Key duplication system with key blank orientation detection features2024
Machine dump body control using object detection2024
Affixation device for securing bone flap2023
Key duplication machine having pivoting clamp2023
Machine dump body control using object detection2023
Identification module for key making machine2023
Loading vehicle and receiving vehicle control2023
Loader frame2022
Sensing dump body characteristics and control2022
Lightweight fatigue resistant railcar truck, sideframe and bolster2022