Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for controlling thickness uniformity of electroplated layers

Method for controlling thickness uniformity of electroplated layers

US Patent 7435323 · Granted Oct 14, 2008

Estimated economic value: $5,972,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and tools for electrical property depth profiling using electro-etching2025
Methods and apparatus for test pattern forming and film property measurement2023
Methods and apparatus for test pattern forming and film property measurement2022
Methods and systems for material property profiling of thin films2020
Ferro-magnetic shape memory alloy microcavity fluid sensor2019
Reel-to-reel reaction of precursor film to form solar cell absorber2015
High efficiency cadmium telluride solar cell and method of fabrication2014
Roll to roll evaporation tool for solar absorber precursor formation2014
Method of fabricating solar cells with electrodeposited compound interface layer2013
Electroplating methods and chemistries for deposition of group IIIA-group via th2013
Method for forming copper indium gallium chalcogenide layer with shaped gallium 2013
Methods and apparatus to provide group VIA materials to reactors for group IBIII2012