Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities

Method and apparatus for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities

US Patent 7433157 · Granted Oct 7, 2008

Estimated economic value: $188,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dark laser heating by positive pulse biasing in heat assisted magnetic recording2024
Dual-spiral common-mode filter2023
Semiconductor device with die-skipping wire bonds2022
Machine learning-based read channel data detection2022
Via-less patterned ground structure common-mode filter2021
Machine learning-based read channel data detection2021
Compact broadband common-mode filter2019
Solenoid filter built into a printed circuit board2019
Read path compensation for SNR and signal transfer2017
Perpendicular magnetic recording write head with spin torque oscillator for fast2013
Conductor suspension structure and electrical connection assembly for transmitti2012
Perpendicular magnetic recording system with magnetic precession for fast switch2012