Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for encapsulating an electronic component using a foil layer

Method for encapsulating an electronic component using a foil layer

US Patent 7425469 · Granted Sep 16, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and mould for encapsulating electronic components mounted on a carrier2025
Mould half and mould method for transfer moulding encapsulating electronic compo2025
Press, actuator set and method for encapsulating electronic components with at l2023
Press, actuator set and method for encapsulating electronic components with at l2022
Method for moulding and surface processing electronic components and electronic 2017
Method and device for encapsulating electronic components with a conditioning ga2012
Device and method for encapsulating with encapsulating material and electronic c2009
Plastic-based composite product and method and apparatus for manufacturing same2005