Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

US Patent 7394150 · Granted Jul 1, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

AI-based determination of action plan for manufacturing component carriers2024
Integrated antenna package structure2024
Device, method and non-transitory storage medium for controlling cutting tool2023
Method of and an arrangement for analyzing manufacturing defects of multi-chip m2022
System and method for efficiently determining and displaying optimal packages of2022
Antenna array and collision avoidance radar having the same2021
Method for fabricating stack die package2020
Method for fabricating stack die package2020
Method for precise localization and treatment of a target site and a medical aux2019
Dual lead frame semiconductor package and method of manufacture2019
Integrated packaging structure2018
Common-source packaging structure2018