Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for filling of a recessed structure of a semiconductor device

Method for filling of a recessed structure of a semiconductor device

US Patent 7365005 · Granted Apr 29, 2008

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Particle reactor for atomic layer deposition (ALD) and chemical vapor deposition2018
Apparatus for atomic layer chemical vapor deposition2004
Measurement of substrate temperature in a process chamber using non-contact filt2003
Processing chamber for atomic layer deposition processes2002
Processing chamber for atomic layer deposition processes2001
Vertically-stacked process reactor and cluster tool system for atomic layer depo1999
Inverted diffuser stagnation point flow reactor for vapor deposition of thin fil1994