Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mold die for a semiconductor device

Mold die for a semiconductor device

US Patent 7355278 · Granted Apr 8, 2008

Estimated economic value: $183,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Detection apparatus and data collection method2024
Acrylic fiber for artificial hair, method for manufacturing said fiber, and head2024
Plant cultivation system and a method for plant cultivation2021
Physical quantity sensor2021
Service status management system2020
Monitoring system and monitoring method2020
Input device, biosensor, program, computer-readable medium, and mode setting met2020
Plant cultivation system and a method for plant cultivation2020
Pulse wave measuring device, mobile device, medical equipment system and biologi2020
Acrylic fiber for artificial hair, method for producing same, and head decoratio2019
Acrylic fiber for artificial hair, manufacturing method therefor and head access2019
Piston and method for manufacturing piston2018