Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive of folder package

Adhesive of folder package

US Patent 7335973 · Granted Feb 26, 2008

Estimated economic value: $16,748,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Combination of palbociclib and adagrasib for lung cancer2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Electroless plating process2025
Methods and apparatus to reduce defects in interconnects between semiconductor d2025
Package with underfill containment barrier2025
Chiplet first architecture for die tiling applications2025
Inorganic-based embedded-die layers for modular semiconductive devices2025
Hybrid conductive vias for electronic substrates2025
Nested interposer with through-silicon via bridge die2025
Dielectric-to-metal adhesion promotion material2024
Electrical interconnect bridge2024
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integ2024