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Home › Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

US Patent 7332438 · Granted Feb 19, 2008

Estimated economic value: $23,325,000 ⓘ

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