Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Redistribution layer with microstrips

Redistribution layer with microstrips

US Patent 7273805 · Granted Sep 25, 2007

Estimated economic value: $448,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for the thermal treatment of a substrate2022
Method and device for encapsulating components2021
Method and device for separating different material layers of a composite compon2020
Method and device for producing a low-emissivity layer system2016
Flash lamp with gas fill for suppressing self-starting2015
Substrate treatment installation2015
Method and device for coating substrates from the vapor phase2014
Method and device for producing stoichiometry gradients and layer systems2013
Dissociated fabrication of packages and chips of integrated circuits2008
Semiconductor chip with flexible contacts at a face2008
Method for producing chip stacks and chip stacks formed by integrated devices2007
Light weight portable scanning electron microscope2007