Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for removing polymer residue from semiconductor wafer edge and back side

Method and apparatus for removing polymer residue from semiconductor wafer edge and back side

US Patent 7267726 · Granted Sep 11, 2007

Estimated economic value: $11,319,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Galvanometer positioning tool and laser printer2025
MEMS microphone and preparation method therefor2024
Micro-Electro-Mechanical System device2023
Method and circuit for obtaining capacitive feedback signal of capacitive feedba2022
Manufacturing method of MEMS chip2018
Parallel plate capacitor and acceleration sensor comprising same2018
MEMS chip and manufacturing method therefor2017
Monitoring structure and monitoring method for silicon wet etching depth2015
Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for prot2009
Plating-rinse-plating process for fabricating copper interconnects2007
Versatile system for wafer edge remediation2007
Vapor deposition of benzotriazole (BTA) for protecting copper interconnects2006