Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

US Patent 7256485 · Granted Aug 14, 2007

Estimated economic value: $37,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

In-vehicle communication system, on-board terminal, portable device, and in-vehi2010
Method of forming a semiconductor device having bonding pad of the second chip t2008