Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package assembly and method for electrically isolating modules

Semiconductor package assembly and method for electrically isolating modules

US Patent 7256068 · Granted Aug 14, 2007

Estimated economic value: $2,127,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatuses and methods for photonic communication and photonic addressing2021
Apparatuses and methods for photonic communication and photonic addressing2019
Apparatuses and methods for photonic communication and photonic addressing2018
Apparatuses and methods for photonic communication and photonic addressing2017
Stacked-chip imaging systems2016
Stacked-chip imaging systems2014
Programmable capacitor associated with an input/output pad2013
Programmable capacitor associated with an input/output pad2011
DVI link with circuit and method for test2010
Programmable capacitor associated with an input/output pad2009
MOS linear region impedance curvature correction2009
Semiconductor package assembly and method for electrically isolating modules2008