Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated capacitor for RF applications with Ta adhesion layer

Integrated capacitor for RF applications with Ta adhesion layer

US Patent 7253522 · Granted Aug 7, 2007

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method suitable for batch ion etching of copper2007
Method suitable for batch ion etching of copper2007
Method of coupling fiber to waveguide2007
Method of connecting an optical element to a PLC2006
Coating formulation and method of production thereof for post print waxable line1995
Real time mottle measuring device and method1990
Composite paper1990
Method of making high quality extrusion coated paper for quality printing1990