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Home › Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same

Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same

US Patent 7250960 · Granted Jul 31, 2007

Estimated economic value: $1,998,000 ⓘ

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