Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of producing an LTCC substrate with cavities having improved bondability

Method of producing an LTCC substrate with cavities having improved bondability

US Patent 7244331 · Granted Jul 17, 2007

Estimated economic value: $29,471,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for LTCC circuitry2010
Method for LTCC circuitry2010
Ceramic screen printing apparatus2009
Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic2008
Method of laminating low temperature co-fired ceramic (LTCC) Material2007
Method of laminating low temperature co-fired ceramic (LTCC) Material2007
Method of fabricating structures using low temperature cofired ceramics2007
Apparatus and method for side printing on low temperature co-fired ceramic (LTCC2006
Method of forming one or more base structures on an LTCC cofired module2006
Method of forming one or more base structures on an LTCC cofired module2006
Method of forming one or more base structures on an LTCC cofired module2006
Method for tuning the center frequency of embedded microwave filters2006