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Home › Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing

Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing

US Patent 7205673 · Granted Apr 17, 2007

Estimated economic value: $5,794,000 ⓘ

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