Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molding compounds for use in induction heating applications and heating elements molded from these compounds

Molding compounds for use in induction heating applications and heating elements molded from these compounds

US Patent 7170038 · Granted Jan 30, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Molding compounds for use in induction heating applications and heating elements2009
Molding compounds for use in furnace blower housings and blower housings molded 2008
Highly conductive molding compounds having an increased distribution of large si2004
Highly conductive molding compounds for use as fuel cell plates and the resultin2002
Process of injection molding highly conductive molding compounds and an apparatu2002
Highly conductive molding compounds and fuel cell bipolar plates comprising thes2001
Low pressure sheet molding compounds1999
Low pressure sheet molding compounds1998